The VeraFlex materials metrology system is a flexible, product wafer, non-destructive system that meets the increasing demands for advanced materials metrology. VeraFlex provides the capabilities needed to address ultra thin film and atomic level materials requirements for next generation semiconductor production.

Installed and operating in production fabs, VeraFlex is used to monitor, measure and control critical materials processes. New VeraFlex applications continue to be developed to meet customer challenges for 65 nm, 45 nm and beyond.