Technology
ReVera Optimized XPS Technology
ReVera’s optimized XPS technology goes beyond established laboratory techniques to provide real-time materials metrology capabilities, configured to meet the demanding requirements of both development and production. ReVera’s use of a non-destructive focused X-Ray beam, stable detection and robust software algorithms results in repeatability, long term stability, and tool-to-tool matching comparable to conventional optical based tools. However, unlike conventional optical tools that use indirect modeling techniques to derive materials parameters, ReVera’s X-Ray based technique provides a direct, unambiguous measurement of thickness and composition, assuring accurate and repeatable results for a broad range of films.
Broad Applications Flexibility
- Measures all elements heavier than Helium in a single system configuration
- Provides compositional metrology for any film or material up to 100 angstroms thick in any part of the process flow
- Measures elemental information directly and does not rely on ambiguous modeled correlations
Versatile Composition and Thickness Metrology
- Provides accurate and repeatable measurements of composition and thickness for ultra-thin single and multi-layers down to a single atomic monolayer
- Identifies changes to surface composition of thicker films, all critical to device performance and reliability
Innovative Bonding States, Interface Quality and Surface Condition Metrology
- Uses optimized algorithms to quickly measure critical composition properties and variations undetectable by most other techniques
- Enables characteristic changes in elemental bonding states, interface quality, and surface condition to be correlated to yield issues
User Friendly for the Fab Environment
- Optimized for the reliability, simplicity and ease of use required for production
- Eliminates the need for a sophisticated hardware system with manual controls that requires operation by a highly educated scientist
Understanding XPS Technology
X-Ray Photoelectron Spectroscopy (XPS) is a powerful analytical technique used to measure critical properties of a film or surface, such as chemical composition and thickness. XPS has been deployed across many industries due to its flexibility, sensitivity and wide span of capabilities.
XPS consists of illuminating a surface with low energy x-rays. The x-rays stimulate the emission of characteristic photoelectrons from each of the atoms in the material. The energy of the emitted electrons contains information about the atom it came from, its depth, its bonding state, the thickness of the film and other critical information. These electrons are collected and analyzed to determine the characteristics required.